Question:
The customer wants to know if SAM can be used to sharpen front edge of the
Ng:Yag laser pulse: 1064 nm, about 10-20 ns long, few ns rise time -
he wants to make it shorter (steep).
Answer:
this is not possible, because the relaxation time of the SAM is quite shorter
than the pulse length. The SAM will be damaged due to overheating during the
pulse and a large amount of optical pulse energy will be converted into heat.
The condition for the sharpening of pulse by a saturable absorber is, that the
relaxation time of the absorber is equal or larger than the pulse duration. May
be, that an organic dye absorber can be used for sharpening of ns pulses.
SAM-1040-1-25.4s saturable absorber mirror, λ = 1040 nm, absorption 1 %, modulation depth 0.5 %, relaxation time 500 fs, chip size 4mm x 4mm, soldered on the center of a copper heat sink with 25.4 mm diameter
SAM-1064-2-25.4g saturable absorber mirror, λ = 1064 nm, absorption 2 %, modulation depth 1.2 %, relaxation time 500 fs, chip size 4mm x 4mm, glued on the edge of a copper heat sink with 25.4 mm diameter
| 1064 nm | |
| Saturable Absorber Mirror Working wavelength 1064 nm (1020-1110 nm) Saturable absorptance 0.5%, 1%, 2%, 3%, 4%, 5%, 6%, 8%, 10%, 12%, 13%, 27%, 30%, 45%, or 70% | |
| Model | Product Name+ | Buy Now |
| SAM-1064-2-FC/PC | SAM 1064 nm, absorptance 2%, mounted: cable |
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| SAM-1064-2-12.7g | SAM 1064 nm, absorptance 2%, mounted: glued |
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| SAM-1064-2-25.0g | SAM 1064 nm, absorptance 2%, mounted: glued |
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| SAM-1064-2-25.4g | SAM 1064 nm, absorptance 2%, mounted: glued |
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| SAM-1064-2-12.7s | SAM 1064 nm, absorptance 2%, mounted: soldered |
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| SAM-1064-2-25.0s | SAM 1064 nm, absorptance 2%, mounted: soldered |
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| SAM-1064-2-25.4s | SAM 1064 nm, absorptance 2%, mounted: soldered |
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| SAM-1064-2-0 | SAM 1064 nm, absorptance 2%, unmounted |
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| SAM-1064-2-0 | SAM 1064 nm, absorptance 2%, unmounted |
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| Displaying 1 to 9 (of 9 products) | Result Pages: 1 |
SAM-1300-4-12.7g saturable absorber mirror, λ = 1300 nm, absorption 4 %, modulation depth 2.5 %, relaxation time 500 fs, chip size 4mm x 4mm, glued on the edge of a copper heat sink with 12.7 mm diameter
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